プリント配線板の製造方法

Manufacturing method of printed wiring board

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a printed wiring board of high reliability, being advantageous in formation of a fine wiring, electric characteristics, and manufacturing cost. <P>SOLUTION: The manufacturing method of a printed wiring board, in which a metal foil whose ten-point average roughness (Rz) of a surface is 2.0 μm or less is used, includes a process in which a roughening process is executed as a pre-process when applying or laminating a solder resist. <P>COPYRIGHT: (C)2008,JPO&INPIT
【課題】微細配線形成や電気特性、製造コストの上で有利であって、尚且つ信頼性が高いプリント配線板の製造方法を提供する。 【解決手段】表面の十点平均粗さ(Rz)が2.0μm以下の金属箔を用いるプリント配線板の製造方法において,ソルダーレジストを塗布または積層する際の前処理として粗化処理を施す工程を有するプリント配線板の製造方法。 【選択図】図1

Claims

Description

Topics

Download Full PDF Version (Non-Commercial Use)

Patent Citations (6)

    Publication numberPublication dateAssigneeTitle
    JP-2001085846-AMarch 30, 2001Ngk Spark Plug Co Ltd, 日本特殊陶業株式会社配線基板の製造方法
    JP-2002036430-AFebruary 05, 2002Matsushita Electric Works Ltd, 松下電工株式会社樹脂付き金属箔及び多層配線板
    JP-2003012836-AJanuary 15, 2003Matsushita Electric Works Ltd, 松下電工株式会社プリプレグ、及び、それを用いた積層板
    JP-2005302997-AOctober 27, 2005Hitachi Chem Co Ltd, 日立化成工業株式会社Printed circuit board having adhesion auxiliary layer between insulating layers and manufacturing method thereof
    JP-H1174636-AMarch 16, 1999Ngk Spark Plug Co Ltd, 日本特殊陶業株式会社配線基板の製造方法
    WO-2006051864-A1May 18, 2006Hitachi Chemical Co., Ltd.Feuille metallique pourvue d’un materiau d’aide a l’adherence et carte de connexion imprimee l’utilisant

NO-Patent Citations (0)

    Title

Cited By (0)

    Publication numberPublication dateAssigneeTitle